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US Patent Issued to SEMES on July 14 for "Crane device, driving method thereof, and stocker including same" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,082, issued on July 14, was assigned to SEMES Co. LTD. (Chungcheongnam-do, South Korea). "Crane device, driving method thereof, and stocker... Read More


US Patent Issued to Kioxia on July 14 for "Cassette housing, prober, server rack, and storage system" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,083, issued on July 14, was assigned to Kioxia Corp. (Tokyo). "Cassette housing, prober, server rack, and storage system" was invented by T... Read More


US Patent Issued to Applied Materials on July 14 for "Dielectric spectroscopy temperature monitoring using electrostatic chuck" (Massachusetts Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,084, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Dielectric spectroscopy temperature monitoring using... Read More


US Patent Issued to Applied Materials on July 14 for "Feature creation in substrate supports" (California Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,085, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Feature creation in substrate supports" was invented... Read More


US Patent Issued to SHIN-ETSU CHEMICAL on July 14 for "Temporary adhesion method, device wafer processing method, laminate for temporary adhesion, and laminate for device wafer processing" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,086, issued on July 14, was assigned to SHIN-ETSU CHEMICAL Co. LTD. (Tokyo). "Temporary adhesion method, device wafer processing method, la... Read More


US Patent Issued to UTAC HEADQUARTERS on July 14 for "Plasma diced wafers and methods thereof" (Singaporean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,087, issued on July 14, was assigned to UTAC HEADQUARTERS PTE. LTD. (Singapore). "Plasma diced wafers and methods thereof" was invented by ... Read More


US Patent Issued to Nexperia on July 14 for "Film frame carrier for a curved wafer stage" (Dutch Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,088, issued on July 14, was assigned to Nexperia B.V. (Nijmegen, Netherlands). "Film frame carrier for a curved wafer stage" was invented b... Read More


US Patent Issued to Resonac on July 14 for "Adhesive sheet, production method for adhesive sheet, roll, and production method for connection structure" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,089, issued on July 14, was assigned to Resonac Corp. (Tokyo). "Adhesive sheet, production method for adhesive sheet, roll, and production ... Read More


US Patent Issued to Applied Materials on July 14 for "Susceptor for process chamber" (California Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,090, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Susceptor for process chamber" was invented by Zhepe... Read More


US Patent Issued to NIPPON ELECTRIC GLASS on July 14 for "Support glass substrate and laminated substrate using same" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,091, issued on July 14, was assigned to NIPPON ELECTRIC GLASS Co. LTD. (Shiga, Japan). "Support glass substrate and laminated substrate usi... Read More